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Contact SupplierCHO-BOND 1035: CHO-BOND® 1035 is a silver-plated glass filled, one component conductive silicone designed for use as a fillet, gap filler and seam sealant for electrical enclosures where EMI shielding or electrical grounding is required. Minimum recommended bond line for CHO-BOND 1035 is 0.007 inches (0.18 mm). The lightweight silver glass filler of CHO-BOND 1035 provides a low cost EMI shielding solution for a variety of commercial and military applications including applications where weight savings are critical. CHO-BOND 1035’s moisture cure silicone polymer system allows it to cure to the touch in 24 hours and provides a flexible, conductive and environmental seal over a wide range of application temperatures.
For best adhesion results, CHO-BOND 1035 should be used in conjunction with CHO-SHIELD 1086 primer.