Cog LCD Display Modules

Offers cog lcd display modules.
Chip-on-glass (cog) is a flip chip bonding method which
is used for connect assembly of bare integrated circuits
on glass substrate directly by using anisotropic conductive film.
the pitch of the ic bumps can be scaled down according to customers requirements. This method reduces the assembly area to the highest possible packing density, which especially important to those applications that space saving is crucial. It allows a cost-effective mounting of driver chips because integrating flex pcb is no longer required. The ic is bonded directly onto
the glass substrate and is suitable for handling high-speed or high-frequency signals.