COOLSPAN Thermally & Electrically Conductive Adhesive (TECA)

COOLSPAN® Thermally & Electrically Conductive Adhesive (TECA) is a thermosetting, epoxy based, silver filled adhesive film used to bond circuit boards to heavy clad metal backplanes, heat sink coins and RF module housings. Thermally robust & lead-free solder compatible Low flow during pressure cure Bonds RF PCBs to heat sinks, pallets and housings Features Thermally and Electrically Conductive Bond Interface Supplied on PET Carrier on PET carrier Low Flow During Pressure Cure High Bond Strength & Thermally Robust Lead-free Solder Compatible and Chemically Resistant