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Contact SupplierCopper Clad FR4
Copper Clad FR4 is an excellent material commonly used for Printed Circuit Board (PCB) fabrication. The fiberglass substrate is a flame retardant (FR4) laminate, typically translucent in color and made of a continuous fine weave woven glass cloth. The fiberglass cloth is then impregnated with epoxy resin, and the copper foil material is adhered through an electroplating process. The copper is measured in microns or ounces per square foot and measures .00134" thick per ounce or 34.1 microns.
Copper Clad PC Boards can be clad double-sided or single-sided. The copper is commonly available in 1/2 oz, 1 oz, and 2 oz weights, although heavier weights are available. Copper can be clad up to 6 ounces while still maintaining a very strong dielectric strength. The FR4 material substrate can be made in yellow, white or black for high end optical applications or aesthetic applications.