Copper Clad Laminates

XTduroid® Copper Clad Laminates for Printed Circuit Boards used in harsh environments
XTduroid laminates utilize PEEK (polyether ether ketone) based dielectric cores. XTduroid laminates are available with or without glass reinforcement. The glass reinforcement offers improved dimensional stability and tensile strength.
XTduroid laminates are available in multiple thicknesses starting from 2mil (50µm). These laminates can be used in flex-to-install and rigid or semi-rigid multilayer PCBs. The absence of adhesive enables thinner pure dielectric resulting in more robust performance. A selection of various copper claddings are available to meet the performance requirements of the application.
These laminates provide excellent high frequency performance when utilizing low profile copper cladding. Both the dielectric constant and dissipation factor are stable over a wide range of temperature and frequencies.
XTduroid laminates are used in applications exposed to harsh environments. Being PEEK based, XTduroid laminates provide stable performance in extreme temperatures (melt temperature 343C649F) in cyclic as well as in continuous operating conditions. PEEK also offers excellent chemical and radiation resistance.