Copper Prime Software

Copper Prime is a specialized microstructure analysis software built for copper and its alloys. It supports quality control, failure analysis, and research by allowing precise evaluation of key metallurgical features such as grain size, porosity, second phase content, dendrite arm spacing (DAS), impurities, and structural defects.

The software enables users to quantify these characteristics and compare them to acceptance criteria, following standardized methods. With modular tools like segmentation, measurement, and coating thickness analysis, Copper Prime provides a flexible and reliable solution for copper-based metallography.

Key Highlights:

1. Built specifically for microstructural analysis of copper and copper alloys
2. Measures grain size, porosity, second phase, impurities, and defects
3. Grain size analysis in accordance with ASTM E112
4. Decarburization evaluation as per ASTM E-1077-91
5. Measures plating or coating thickness using cross-sectional microscopy
6. Histogram-based segmentation with multiple phase overlays
7. One-time settings configuration for ISO/ASTM calibration and reports
8. Saved reports and organized gallery for easy retrieval and review