- Supply TypeManufacturer, Exporter, Supplier
- Preferred Buyer Location All over the world
Encapsulation Cases & Cup for Electronic Component Packaging. Cups are fabricated from *G10FR4 and XPC Phenolic. Headers available to fit the inside or the outside of all cases and cups. Round cups also can be fabricated from Epoxy filled and unfilled tubing. Excellent resistance to chemical attack from both acid and alkaline material.
Member Since 8 Years
Nature of Business Supplier
For Buyer 
For Seller 
Help 
United States