Diamond Cutting Blades, Brand Name : More super

ur expapplicationertise encompasses a broad range of electronic materials including Mono Crystalline and Poly Crystalline Silicon, Sapphire ,Quartz, Specialty glasses, and a variety of other hard compounds and ceramics. Whether your concern is part quality or productivity, �MORESUPERHARD � dicing blades step up to the challenge.
Our cutting discs are mainly including Resin diamond dicing blade, Metal bond dicing blade and Electroplated bond dicing blade.
NO.1 Resin diamond dicing blade
Introduction of Resin bond dicing blade:
Resin bond blades with the characteristic of vertical consumption can efficiently reduce the occurrence of grain deformation and improve the cutting quality and efficiency on hard and brittle materials.
Features of Resin bond dicing blade:
Improve the cutting quality and efficiency on hard and brittle materials.
A wide selection of bonds available for high-grade processing on hard and brittle materials.
Ultra thin blade (over 50um)
Applications of Resin bond dicing blade:
Hard and Brittle Materials, Ceramics, Optical Glass, Glass for Optical Fiber Communication, Splitter, IR Filter, QFN
The pictures of Resin bond dicing blade:
resin dicing blade
NO.2 Metal bond dicing blade
Introduction of Metal bond dicing blade:
Metal bond blades, the sintered diamond blades with the addition of metal powder in bond, have high retaining force for grain.
With the higher wear-resistance and advanced cutting capability and higher stiffness, the metal bond blades can effectively reduce cutting defects like slanted-kerf.