Diamond Dicing Blades, Brand Name : More super

The type: diamond hub dicing blade and diamond hubless dicing blade
electroformed diamond hub dicing blade
features:
easy to handle ultra-thin blade; blade dicing after laser grooving; variety of different grit concentrations; shows stable processing performance in high load processing
2.hub dicing blade
application: silicon wafers, compound semiconductor wafers (gaas, gap),oxide wafers (litao3)
3.resin dicing blade
features:
high processing quality for cutting of hard, brittle materiais; able to precisely control diamond concentration to achieve cutting quality; improved cut quality on hard materials
hubless dicing
blade
application:
glass, crystal, quart, litao3, ceramics, optical, qfn, splitter
metal dicing blade
metal dicing balde
features:
high rigidityminimized wavy and slant cutti
g ; able to control diamond concentration to
achieve cutting quality ;excellent rigidit and
cut quality
application: electronic parts, optical devices, semiconductor packages, bga, csp,
electroformed dicing balde
electroformed dicing
balde
features:
wide selection of blade options; proprietary
thin-blade technology ;blade thickness - 0.0
15 mm to 0.3 mm; available for both dicing
saws and slicers
application: various types of semiconductor packages, ceramics, magnetic materials, pcb, silicon.