Diamond Dicing Blades

Diamond dicing blade is used for grooving ,cutting silicon, compound semiconductors, glass and other materials in electronic information industry. Diamond dicing blade is one of new products developed .
The Type: diamond hub dicing blade and diamond hubless dicing blade
Electroformed diamond hub dicing blade
Features:
Easy to handle ultra-thin bladeBlade dicing after laser groovingVariety of different grit concentrations Shows stable processing performance in high load processing
Hub dicing blade
Application: Silicon wafers, compound semiconductor wafers (GaAs, Gap),oxide wafers (LiTaO3)
resin dicing blade
Features:
High processing quality for cutting of hard, brittle materiais
Able to precisely control diamond concentration to achieve cutting quality Improved cut quality on hard materialsHubless dicing blade
Application:
Glass, Crystal, Quart, LiTaO3, Ceramics, Optical, QFN, splitter
metal dicing balde
Features:
High rigidityminimized wavy and slant cutting
achieve cutting quality
Excellent rigidity and cut quality
Application: Electronic parts, Optical devices, semiconductor packages, BGA, CSP,
Electroformed dicing balde
Features:
Wide selection of blade options
Proprietary thin-blade technology
Blade thickness - 0.015 mm to 0.3 mm
Available for both dicing saws and slicers
Application: Various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon
Other specification can be produced according to customer’s requirements
anna.wang@moresuperhard.com www.moresuperhard.com
In addition to diamond dicing blades for semi-conductor & LED industry, More Superhard Products Co,.Ltd also supplies :
Silicon grinding wheels are used for the thinning and fine grinding of the silicon wafer.