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    Diamond Laser Sawing System

    • Supply TypeManufacturer, Exporter, Supplier, Retailer
    • Preferred Buyer Location All over the world

    TECHNICAL DETAILS: Technical Details: Laser Type : Diode Laser Frame Design : Modular Beam Quality : M2 < 1.2 Working Power : 20 W Resolution : 1 micron Repeatability : 3 micron Laser repetition....
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    Company Information

    • calendar Member Since 23 Years
    • building Nature of Business Manufacturer
    • Year of Establishment 1989

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    TECHNICAL DETAILS:
    Technical Details:
    Laser Type : Diode Laser
    Frame Design : Modular
    Beam Quality : M2
    Working Power : 20 W
    Resolution : 1 micron
    Repeatability : 3 micron
    Laser repetition freq. : 1 kHz to 80 kHz
    CNC Movement (mm) : 170 x 170
    Drive : Servo
    Dimension : 1810 x 900 x 1390
    Features:
    • Laser Fire Protection System (LFPS)
    • Dust free Resonator
    • High quality with stable laser beam from USA made Diode module
    • Smooth cutting surface
    • Almost NILL breakage rate
    • Single phase power requirement
    • Auto frequency
    • Database log of processed diamonds are stored for later utilization
    • TSS fixture with advance pass
    • Auto next system
    • Fuzzy logic been used for software intelligence enabling smooth sawing of the stones
    • Facility to interface with planner machine


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