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    Double Sided Printed Circuit Board

    • Surface FinishingOSP, Immersion Tin , Lead free HAl ENIG
    • Cu Foil Thickness35 micron to 105 micron
    • Prodcution Capacity15,000 sqm/month
    • Minimum Track Width4 mil
    • Supply TypeManufacturer, Exporter, Supplier, Retailer
    • Preferred Buyer Location All over the world
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    • calendar Member Since 7 Years
    • building Nature of Business Retailer

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    • Surface FinishingOSP, Immersion Tin , Lead free HAl ENIG
    • Minimum Spacing between the Tracks and Pads4 mil
    • Prodcution Capacity15,000 sqm/month
    • Laminate Thickness0.2mm to 3.2mm
    • Minimum Hole Size (CNC Drilling)0.2mm
    • Maximum PCB Size630mm X 1800mm
    • Cu Foil Thickness35 micron to 105 micron
    • Minimum Track Width4 mil
    • Types of LaminatesCEM3, FR 4

    Specification. Standards:

    IPC-A-600, IPC-SM-840, IPC-RB-276, IPC-TM-650. MIL 55110P, MIL P13949G

    Sector Catered - Automobile, Consumer Electronics, Computer Periferals, Lighting, Telecom, Defence, etc.


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