- Supply TypeManufacturer, Exporter, Supplier
- Preferred Buyer Location All over the world
COOLSPAN® Thermally & Electrically Conductive Adhesive (TECA) is a thermosetting, epoxy based, silver filled adhesive film used to bond circuit boards to heavy clad metal backplanes, heat sink coins and RF module housings. Thermally robust & lead-free solder compatible Low flow during pressure cure Bonds RF PCBs to heat sinks, pallets and housings