Company Information
Member Since 7 Years
Nature of Business Manufacturer Year of Establishment 2013Ask for more detail from the seller
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Applications of hub dicing blade:
cutting Silicon Wafers, copper wafer, IC/LED Packages, Compound Semiconductor Wafers (GaAs, Gap),Oxide Wafers (LiTaO3), Optical Glass
The features of hub type dicing blade:
* improving balance between blade life and processing quality (in particular backside chipping)
* Strengthens rigidity, Reduction in wavy cutting and blade wear under high load conditions
* precise control of diamond grit size, diamond concentration, and nickel bond hardness to reduce splitting on the edges
* Realizes high speed wafer cutting after laser grooving.
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