Electronic Control Units Lead Bonding Machine, Color : Blue

A precise device used in microelectronic packaging to achieve electrical connections between chips and substrates. Its core function is to bond aluminum wires to designated positions through methods such as hot pressing or ultrasonic waves.

Characteristics：

• Directly control the actions such as the lowering of the hot press head and the emission of ultrasonic waves through the handle or button. It is suitable for small-batch production, research and development, or maintenance scenarios, with high flexibility.
• It usually includes a high-precision temperature controller to ensure the stability of the hot press head temperature; uses pneumatic components (such as CKD, AirTAC) to provide stable pressure; is equipped with a microscope observation system, which is convenient for aligning micro-metric solder joints.
• Key process parameters (such as temperature, time, and pressure) can be manually set according to product requirements. The system also has the function of automatic fault detection and alarm, enhancing production safety.