Electronic Devices

Sinopack provides miniaturized surface mount ceramic packages with cavity structures available . Hermetic or vacuum-sealing is typically applied to ensure device quality. These ceramic packages are suitable for use in sensors due to the high modulus of elasticity and low coefficient of thermal expansion of ceramic materials.
Sinopack devotes to the R&D and manufacturing of multilayer ceramic packages. The main products are HTCC, LTCC, and ALN ceramic packages and substrates. products cover different domains  such as optical communication module package, power laser package, microwave device package, high-  density integrated circuit package, ALN substrate products and other fields of package. Committed to doing a good job for the ceramic package , efforts to build a high quality brand, with sincerely heart to provide the highest quality products.