Electronic Potting Silicone, Packaging Type : transparent

We are offering electronic potting silicone.
electronic potting silicon applications:
electronic potting silicon: is mainly applied for the surface of polycarbonate, pp, abs, pvc, metal etc., which is suitable for the electronic moisture-proof and waterproof, fixed. It is applicable to sealing bonding coating led for electronic parts.
electronic potting silicon features:
electronic potting silicon: is two-component condensation cure silicone with the characteristics of low viscosity, easy operation, good bonding feature. The safety of potting compound silicone can reach the eu-rohs requirements fully.
electronic potting silicon: operations:
1. Electronic potting silicon: first stir the part a completely before using (to be sure the segiment is evenly mixed) to mixing the part b with past a.
2. Electronic potting silicon:: mix the part a and part b completely according to the mix ratio (10:1 by weight) and can be used after deaired about 3 minutes.
3. Electronic potting silicon::this product can be vulcanized at room temperature. After basic curing then go to the next step. Full curing process will be within 24 hours. The enviromental temperature, especially the humidity, will affect the curing time greatly. Customers should make appropriate adjustments according to local conditions. The mixed silicone should be finished at one time to avoid any waste of material.
electronic potting silicon: packaging, storage and transportation:
1. Electronic potting silicon: is vacuuming packed with 20kg/drum a. 2kg/drum b.
2. Electronic potting silicon: should be stored in a cool dry place, avoid the sun and rain, it must be kept away from acids, alkalis, salts and other compounds.
3. Electronic potting silicon:, shelf life is one year from the date of production under 25°c , and it can be re-used through a re-examination even if over its storage period.
electronic potting silicon: standard datasheet for your reference:
model: 9300#
viscosity (cp): 800±1000
hardness (ao): 0 a
thermal conductivity(w/k); ≥0.2
dielectric strength(kv/mm):≥25
dielectric constant(1.2h):3.0-3.3
mixing ratio (%): 1:1
operating time(min): 20-30
curing time(h):8
any questions of electronic potting silicon:, please feel free to contact ms vicky:
e*mail: hyz(at)szrl(dot)net
tel: 0086-755-89948013
fax: 0086-755-89948030
mobile: 0086-13751020433