EP-IRPS-20 Picosecond Laser Marking Machine for Cutting, Drilling

1. Cutting and drilling of brittle materials such as glass, sapphire and ceramics.
2. LCD, OLED screen cutting (C, R, U angle cutting).
3. Ultra-precise Mark points on the glass material, fine invisible QR code (0.2mm) and other fine marks.
Good beam quality, small spot size for ultra-fine marking.
2. The heat affected zone is small, avoiding damage to the processed material and high yield.
3. Marking speed, high efficiency, high precision.
4. No consumables, low cost of use and maintenance.
5. The machine performance is stable, long-term operation.
Specifications:
Machine model EP-IRPS-20
Laser wavelength 1064nm
Laser power 20W / 10ps / 1000kHz
Repeated frequency 1000KHz
Marking scope 100*100mm
Marking line width ≤0.03mm
Marking depth ≤0.1mm
Min. character 0.06mm
Marking speed ≤7000mm/s