Epoxy Glue For Thermal Conductive

.thermal conductivity: 1.0w/m-k  . Two components: a & b . Auto deaeration . Good high & low temperature resistance . Good physical and chemical stability . Reach, rohs and ul compliant   applications . . Power transistor module . Led driving power . Integrated chipset. Led encapsulation. Power module. Telecom devices . Others   epoxy ab gluethermal conductive adhesive for electronic potting       1.    flame retardant approvalul94-v0. 2.    good electrical properties. 3.    long pot life. 4.    low shrinkage. Strong bonding strength to most substrates. 5.    excellent thermal conductivity. 6.    very good chemical resistance and waterproof. 7.    high heat distortion temperature (hdt). High rti.                         color(after dry) white,black viscosity(cps25℃) 85000~100000 mix scale(scale) 10:1 operation time (hr,25℃) 1.5~2h dry time (hr,25℃) 24h (hr,60℃) 2-3h       after dry shrink(%) ＜0.5 temperature(℃) -50℃~+200℃ hardness d ＞80 break voltage(kv/mm) ＞25 thermal conductivity(w/m·k).