Filling Machine

Vacuum Plugging Machine VCP5000-1  

• Panel is placed inside themachine and vacuum is optionallydrawn inside the chamberdepending on the hole fill requirements
• Utilizing a similar principle as the hand-held unit, compressed air is used to force the material into a designated head and then through the via holes
• Depending on factors, such as hole quality and paste rheology, holes up to 1:40 aspect ratio can be filled; the vacuum is not needed for through-holes
• Cu plated blind vias can be easily filled without any voids utilizing the vacuum
• Excess material is removed by squeegee system

Via Hole Filling VHF 300V w/ a Vacuum function 

• Flexible plugging machine allowing different types of panels and pastes to be processed
• handles boards at the extreme ends of the board thickness spectrum (up to 350 mil)
• minimizes consumption and waste of paste (smaller heads can be used)
• Max. panel size 24” x 30”
• Thickness range is up to 350 mil thick
• 480 Volt, 3 Phase power connection, 4 kW
• The touch panel display allows up to 50 recipes to be stored
• Head sizes available: 5”-12"
• Speed of head movement in the X and Y direction

Plane Raze Device SV100 Uniform finish with fine surface roughness 

• Superior sanding is achieved by sanding pressure controlled rotation and oscillation head motion
• Sanding after hole plugging
• Deburring and dressing after
• through hole drilling (thick panels
• Dressing after plating, built-up PCB
• Dressing and cleaning of stainless press plates
• Dressing of multilayers