As telecommunications and networking technology advances, systems increasingly call for optical backplanes with high-fiber counts and cross-connect systems. Molex's FlexPlane™ Optical Backplane Circuitry provides a manageable means of fiber routing from card-to-card or shelf-to-shelf. Designed for versatility, standard FlexPlane™ Circuitry provides high-density routing on a flexible, flame-resistant substrate.
As applications grow more demanding, available real estate on PCBs shrinks and adequate airflow becomes a vital part of design requirements. 3D FlexPlane™ Optical Backplane Circuits provide almost a 50% substrate size reduction compared to standard FlexPlane™ Circuitry. 3D FlexPlane™ routes the fiber on multiple stacked substrates to achieve a compact routing area while the standard routes flex circuits on a single substrate.
Telecommunication and networking modules often need to be quickly replaced on backplanes without disrupting the entire system. System architects also need design flexibility to meet the particular demands of each application. Blind Mate MTP (BMTP™), High Density Blind Mate MT (HBMT™ ), Blind Mate LC (BLC™ ) and Blind Mate SC (BSC™ ) Optical Backplane Connector Systems can be used to connect FlexPlane™ Optical Flex Circuits to individual cards in a shelf. Available in any routing scheme, fiber can be routed point-to-point, in a shuffle or in a logical pattern to meet specific requirements. Direct or fusion-spliced terminations are available

As telecommunications and networking technology advances, systems increasingly call for optical backplanes with high-fiber counts and cross-connect systems. Molex's FlexPlane™ Optical Backplane Circuitry provides a manageable means of fiber routing from card-to-card or shelf-to-shelf. Designed for versatility, standard FlexPlane™ Circuitry provides high-density routing on a flexible, flame-resistant substrate.
As applications grow more demanding, available real estate on PCBs shrinks and adequate airflow becomes a vital part of design requirements. 3D FlexPlane™ Optical Backplane Circuits provide almost a 50% substrate size reduction compared to standard FlexPlane™ Circuitry. 3D FlexPlane™ routes the fiber on multiple stacked substrates to achieve a compact routing area while the standard routes flex circuits on a single substrate.
Telecommunication and networking modules often need to be quickly replaced on backplanes without disrupting the entire system. System architects also need design flexibility to meet the particular demands of each application. Blind Mate MTP (BMTP™), High Density Blind Mate MT (HBMT™ ), Blind Mate LC (BLC™ ) and Blind Mate SC (BSC™ ) Optical Backplane Connector Systems can be used to connect FlexPlane™ Optical Flex Circuits to individual cards in a shelf. Available in any routing scheme, fiber can be routed point-to-point, in a shuffle or in a logical pattern to meet specific requirements. Direct or fusion-spliced terminations are available