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Contact SupplierLaser cutting machine usage the machine is used to cut cover layer cvl, flex printed circuit board fpc, flex-rigid circuit board rf. Includes base materials, such as: silicon, ceramics, rubber, fr4, 3m, pp, pi reinforcement; with high quality, high speed cutting thickness of up to 1mm (0.04). There is no burrs, no stratification. The cutting edge and sidewall is smooth. Feature 1、precision:adopting linear motor module,servo control, sizing compensation, optical positioning and secondary positioning technologies. 2、high quality: little carbonization and high density graphics cutting. 3、highly intelligent、efficient:with multi-panels cutting、auto-positioning、auto-correcting、automatic sizing compensation and exclusive cutting previews functions.