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HandyLink I/O Interconnect System

Listing ID #3380038

  • CategoryI/O Connectors
  • FeaturesSupports USB transmission speeds 500 ns rise time and 2 pF capacitance,Reduces real estate and minim
  • Current1.0A
  • Supply Type Manufacturer, Exporter, Supplier
Preferred Buyer From : All over the world
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  • Member Since 7 Years
  • Nature of Business Retailer

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Product Details no_img_icon

The HandyLink interconnect product family from Molex includes a right-angle SMT receptacle, wire and PCB version plugs, perpendicular and parallel mounted cradle connectors for docking applications and a wide array of cable assemblies.
An innovative compression-style contact design provides long-term performance and reliability that supports mating cycles up to 15,000. The compact size and continuous current-carrying capability of 1.5 to 3.0A depending on circuit configuration, provides an optimal solution for the mobile device industry. The patented integrated-latch design provides optimal Electrostatic Discharge (ESD) protection and mechanical integrity.


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  • Seller Molex India Limited
  • Address Tharamani, Chennai, Tamil Nadu

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HandyLink I/O Interconnect System at Best Price in Chennai - ID: 3380038
Products / Services
  • Products / Services
  • Companies
  • Buy Leads
Post Buy Requirement

HandyLink I/O Interconnect System

Listing ID #3380038

  • CategoryI/O Connectors
  • Current1.0A
  • FeaturesSupports USB transmission speeds 500 ns rise time and 2 pF capacitance,Reduces real estate and minim
  • Supply Type Manufacturer, Exporter, Supplier
Preferred Buyer From : All over the world
Send Enquiry

Company Information

  • Member Since 7 Years
  • Nature of Business Retailer

Ask for more detail from the seller

Contact Supplier

Product Details no_img_icon

The HandyLink interconnect product family from Molex includes a right-angle SMT receptacle, wire and PCB version plugs, perpendicular and parallel mounted cradle connectors for docking applications and a wide array of cable assemblies.
An innovative compression-style contact design provides long-term performance and reliability that supports mating cycles up to 15,000. The compact size and continuous current-carrying capability of 1.5 to 3.0A depending on circuit configuration, provides an optimal solution for the mobile device industry. The patented integrated-latch design provides optimal Electrostatic Discharge (ESD) protection and mechanical integrity.


Tell us your Buy Requirement to Get Instant Response
Tell us what you need?

Looking for HandyLink I/O Interconnect System?

Quantity
Seller Contact Details
  • Seller Molex India Limited
  • Address Tharamani, Chennai, Tamil Nadu

Find Seller from near by Cities

Waiting for permission
To search by voice, go to your browser settings and allow access to microphone

Allow microphone access to search with voice