Heat Gun For Desoldering & Removal Of SMD IC From Printed Circuit Boards.

Hot air gun can also be used to undo soldered joints, e.g. copper pipes, at 600 deg celsius. Attach a reduction nozzle and heat the soldered joint. After approx. 90 seconds loosen the copper pipe with the pipe wrench. Don't touch the pipe, as you might burn yourself!
Hot air (approx. 400 deg celsius) can also be used to desolder electronic components from damaged circuit boards of mobile phones as well as other electronic items. Concentrate the hot air on the solder joint and remove the component with a special pair of pliers once the solder melts.
Desoldering electronic components from faulty circuit boards is possible with tatgeted flow of hot air gun. Use of reduction nozzle and clamp the circuit board in a vice. after heating the solder point (to approx. 280 deg celsius) you can remove the components with pair of pincers. As high temperature irreparably damage semicondustors, it is only recommended to use hot air on defected circuit boards.
To unsolder copper pipes, its best to use reflector nozzle.