High Density Copper Flex Cables

High-Density Copper Flex Cable products that offer micro via and fine line features required for today’s circuit designs in support of small, tightly compacted, electronic packaging solutions
When routing space and via diameters need to be minimized, Molex HDI Copper-Flex Products offer a cost-effective substrate solution. In fact, high-density flex enables line width, spacing and pad size to be up to 50% smaller and hole size up to 75% smaller than standard flex. Additionally, high-density flex capabilities provide a three-dimensional packaging option. When package size and component density are limiting available board space and layer count, turn to Molex High-Density Copper Flex to solve packaging challenges.