High Grade Micron Diamond Powder

Model No: SMT-HA (High Strength)

• Property : Good diamond with high strength and high purity as raw material, with regular crystal shape, concentrated size distribution, tiny impurity, high thermal stability and high abrasive resistance.
• Usage : Used in PCD, metal bond, vitrified bond; grinding and polishing semiconductor, optical glass, fine ceramics, diamond, precision bearing, seal components; producing diamond abrasive paste.
• Available Size : W0-0.5, W0-1, W0.5-1, W0.5-1.5, W0-2, W1-2, W0.5-3, W1-3, W1.5-3, W2-3, W2-4, W2-5, W3-6, W3-7, W4-8, W4-9, W5-10, W5-12, W6-12, W8-12, W8-16, W8-20, W10-20, W12-22, W12-25, W15-25, W20-30, W22-36, W20-40, W30-40, W30-50, W36-54, W40-50, W40-60

Model No: SMT-HB (Super Fine)

• Property : Mono-crystal diamond powder with good quality diamond as raw material, with advanced selecting techniques, under submicron and nanometer size.
• Usage : Grinding,  polishing and fine processing in super hard and brittle material such as fine ceramics, integrated circuit chip, diamond, quartz; as additive for wearable composites, composite coating and lubricating material. Widely used in aerospace, precision mechanism, optical instrument, automotive industry as ideal polishing material.
• Available Size : W0-0.05, W0-0.1, W0-0.125, W0-0.2, W0-0.25, W0-0.5, W0-1, W0.5-1, W0.5-1.5, W0-2, W1-2, W0.5-3, W1-3, W1.5-3, W2-3, W2-4, W2-5, W3-6, W3-7, W4-8, W4-9, W5-10, W5-12, W6-12, W8-12, W8-16, W8-20, W10-20, W12-22, W12-25, W15-25, W20-30, W22-36, W20-40, W30-40, W30-50, W36-54, W40-50, W40-60

Model No: SMT-HC (Super Pure)

• Property : Adopted good quality MBD series diamond as raw material, by special purifying process, to ensure clean particle surface, impurity under PPM; with fine stable dispersion and suspension under water and oil based condition after special surface modifying treatment, to ensure the efficiency of grinding and polishing; concentrated size distribution, super high equivalent shape, fine heat resistance and abrasive resistance.
• Usage : For PDC,  lapping liquid; grinding, lapping and polishing material under special surface processing.
• Available Size : W0-0.05, W0-0.1, W0-0.125, W0-0.2, W0-0.25, W0-0.5, W0-1, W0.5-1, W0.5-1.5, W0-2, W1-2, W0.5-3, W1-3, W1.5-3, W2-3, W2-4, W2-5, W3-6, W3-7, W4-8, W4-9, W5-10, W5-12, W6-12, W8-12, W8-16, W8-20, W10-20, W12-22, W12-25, W15-25, W20-30, W22-36, W20-40, W30-40, W30-50, W36-54, W40-50, W40-60