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    High Power LED Light

    • Flatness0.001"/1" (1μm/1mm)
    • Au 40-80 μin (1-2 μm) 
    • PlatingNi 160-250 μin (4-6 μm) /
    • Surface FinishRa 16 μin (0.4 μm)
    • Parallelism0.0005" (0.01mm)
    • Supply TypeManufacturer, Exporter, Supplier, Retailer
    • Preferred Buyer Location All over the world
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    Company Information

    • calendar Member Since 6 Years
    • building Nature of Business Retailer

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    Product Details no_img_icon

    • PlatingNi 160-250 μin (4-6 μm) /
    • Au 40-80 μin (1-2 μm) 
    • Flatness0.001"/1" (1μm/1mm)
    • Surface FinishRa 16 μin (0.4 μm)
    • Parallelism0.0005" (0.01mm)

    Momentive Performance Materials Inc. offers a unique heat sink product that contains a TPG* core (>1500 W/m-K) and a coefficient of thermal expansion (CTE) matched enclosure for superior thermal management performance. The TPG-EX composite heat sink provides:

    Potential Applications

    • Power electronic package RF microwave package Laser diode
    • High power LED

    Packaging standards(MIL-STD-883H) qualified

    • Hermeticity
    • Thermal cycling
    • Shock vibration resistances


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