Infrared Bga Rework Machine, Brand Name : CHINAFIX

we are offering infrared bga rework machine.
power supply:ac 220v50-60hz
heating method:two-side infrared heating
demension:lmm360*wmm520*h430mm
maximum power:2.3kw
pcb size:405mm*310mm
upper heating control method:high-precision closed-loop control, instrument error is about 0.5%
upper temperature control and measuring method:high sensitivity temperature sensor, temperature monitoring indirectly.(monitor temperature of heater element)
bottom heating control method:high-precision closed-loop control, instrument error is about 0.5%
bottom temperature control and measuring method:high sensitivity temperature sensor, temperature monitoring indirectly. (monitor temperature of heater element)
application type:be suitable for welding,sealing-off or repairing bga,pbga,csp on different pcb and more kinds of encapsulation mode component, all suitable for lead or lead-free soldering.
suitable chip size:less than 50mm
features:
1.high success rate: high success rate of welding can reduce user's cost, otherwise low success rate will increase user's loss greatly, which is very important for maintenance industry.
2.high reliability: high reliability is the direct guarantee of high success rate and it can reduce manipulation strength greatly at the same time, users mastered repair equipment characteristic can not to stay by machine during welding, otherwise users will waste a lot of valuable time and it's difficult to guarantee the success rate because of low reliability.
3.easy to operate: it can make users master of operation method as soon as possible and save operation time directly, thus improving working efficiency.
4.applicability: due to the type and size of electronic components with bga packaging technique are various and will be more and more kinds, pcb board's size and quality are different greatly, so the applicability is necessary.