Laser Cutting Machine- S0302-50

Product featuress0302-50 laser slicer adopts yag laser, high speed stepping moter and controlling software researched by our company to realize slice function. It is applied mainly in silicon wafer semiconductor industry, specially suits for solar wafer cutting. It belongs to nontouch cutting and can cut many breakable goods. Comparing with other slicer uv laser slicer has many advantages as below: high output power, high slice accurancy, high speed, can cut curve and beeline, non-polution, low noise, stable function and so on.applications & materials solar wafer cutting technical datamax. Laser average power :>b> 50w wave length : 1064nm repeat frequency :