Laser Cutting Machine- UV-5c

Product features uv-5c automatic silicon wafer cutter adopts 5w uv laser which researched by our company and we hold intellectual property as optic source. The system matches a high accurancy 2d worktable, revolving worktable and ccd orientation system, which make sure the accurancy of cutting track. It has automatic delivery equipment, the image manipulation system can gather, identify and deal with the ccd image, which realize automatic process from delivery, cutting to unload. It processes materials without touch in working. Uv laser is luminescence source, has small thermal effect area. After cutting the electric data of crystal ia better than tranditional mechanical processing manner, improving product rate of crystal. The cutting speed is 1-2 times faster than mechanical cutting manner, also it need not consumed materials in cutting, which can improve producing efficiency and save cost.applications & materials silicon wafer cutting technical datamax. Laser average power : 5w wave length : 355nm cutting area : 3-8" cutting depth : 0.5mm cutting speed : 30-80mms cutting ine width : 0.02-0.05mm(depending on materials) min. Character size : 0.3mm repeat accuracy : 0.003mm rotation accuracy : 0.001 degrees input power : 1.8kw electrical source : 220v 50hz15a dimensions : 1850mm1300mm2000mm cooling system : 650mm343mm715mm