Laser Marking Machine, Laser Wavelength : 1064nm

Features:
UV laser processing is achieved by photochemical ablation
Strong energy of laser can interrupt bonding between atoms or molecules and transform them into small molecules
Small molecules are easy to evaporate
Excellent beam quality, smaller focused spot size and ultra fine marking
Since most materials can absorb UV light, application ranges are much more wider
Small heat-affected region, no thermal effects and burning issue
High speed and efficiency
Stable performance, compact size and low power consumption
Advantage focused spot size of UV light small and heat affected zone minimum, used in ultra-fine and special materialâ??s marking
First choice of customers who have higher expectations of marking effect
Since UV laser did not produce any thermal effects and burning issues, result of marking precise, smooth and steep
Lot of material will absorb UV light at 355nm wavelength except copper, UV laser suitable for processing much more varieties of materials
Applications:
Mainly used in high-end ultra refining market, marking on surface of cosmetics, pharmaceuticals, food and polymer bottles
Nice marking effect, sharp and permanent, which better than ink jet printing and no pollution produced
Also used in marking and dicing on flexible PCB board, drilling tiny hole or dead hole on silicon wafers, two-dimensional coding on LCD, glassware surface, metal surface coating, plastic keys, electronic components, gifts, communication equipment and construction materials
Specifications:
Laser output power: 1.7, 3, 4, 5, 8 and 10W
Laser wavelength: 55Nm
Beam quality:M2: greater than 1.1
Pulse width: 10 to 50ns
Q frequency: 8 to 70kHz
Marking range: 100 x 100mm
Marking liner speed: ≤7,000mm/s
Minimum line width: ≤0.005mm
Repetitive accuracy: ±0.003mm.