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    Laser Scribing Machine for Thin-film Solar Cell

    • UsageThin-film Solar Cells P1/P2/P3 Laser Scribing, Laser Insulation Scribing
    • Processing EfficiencyMulti-head Simultaneous Processing, High Efficiency
    • Processing GraphicsDifferent Processing Graphics
    • Processing QualityGood, Cut Without Residue, Consistent Line Width, Stable Process Flow
    • Suitable ForCIGS, CdTe, Perovskite, Color-changing Glass
    • Supply TypeManufacturer
    • Preferred Buyer Location All over the world
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    • calendar Member Since 9 Years
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    • UsageThin-film Solar Cells P1/P2/P3 Laser Scribing, Laser Insulation Scribing
    • Processing GraphicsDifferent Processing Graphics
    • Suitable ForCIGS, CdTe, Perovskite, Color-changing Glass
    • Processing QualityGood, Cut Without Residue, Consistent Line Width, Stable Process Flow
    • Processing EfficiencyMulti-head Simultaneous Processing, High Efficiency

    Suitable for thin film batteries such as CIGS, CdTe, perovskite, and color-changing glass.
    Mainly used in P1/P2/P3 laser scribing of thin film solar cells, and laser insulation scribing
    The thin film battery is divided into small pieces by laser scribing and connected in series at the same time, so as to reduce the loss of electric energy and increase the output voltage
    Main features
    The processing quality is good, cut without residue and does not hurt the bottom. The line width is consistent, and the process flow is stable;
    Different processing graphics;
    Multi-head simultaneous processing, high processing efficiency.
    Main Parameters
    Basic function Thin-film solar cells P1/ P2/ P3/ laser scribing/ P4
    laser edge cleaning (select laser corresponding to different processes)
    Can customize thin film solar cell/BIPV/smart photovoltaic glass solution
    Laser generator lifetime 10000 hours
    Work hole diameter 1500mm/s
    The position of the holes that can be machined multi-channel simultaneous machining
    Minimum center distance of machinable holes Round, square spot
    Machining hole position accuracy ±0P1: 20-60um, P2: 40um-80um P3: 40um-80um
    Laser power >2MΩ
    Hole appearance requirements >1GΩ@1KV


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