
Company Information
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Contact SupplierWe specialize in offering a superior range of Laser Scrubbing Machine to our clients, which is designed in accordance with industry standards. These Laser Scrubbing Machines are widely used in various industries such as electronics, semiconductor and solar energy for scribing cutting different silicon wafer, solar cell, ceramic wafer. It is also capable of scribing cutting thin metal sheet (~0.5 mm thick maximum).
Features
Excellent beam quality and system reliability
High-speed scribing (up to 300 mms), very low-defective index
Compact design, dual protective systems
Precise CNC worktable
Friendly man-machine interface and simple software operation