LEAD FRAME FIXING TAPE

The engineers at Tomoegawa USA Paper developed our advanced technology ELEPHANE R7 Series tape for fixing lead frame inner leads in DIP and QFP package applications. Inside of our R&D facility, they formulated an electrically insulative, non-conductive adhesive and applied it to a base polyimide film, then added a protective PET layer. Laminated on wide 35 mm – 1,400 rolls, it is slit to widths of 5 mm or greater in 0.1 mm increments, which enables us to achieve tight tolerance results. ELEPHANE R7 withstands the extremely high temperatures of IC package assembly, and it also adheres at low temperatures for thermosetting applications. In addition to its low ionic impurities, it also exhibits low out gassing and high electrical reliability.
Formulated to tolerate temperatures of 120°C-240°C, the flexibility of our manufacturing process allows us to adjust the parameters based on specific customer requirements. To learn more about this product, or our processes, and how they can benefit your semiconductor assembly operations, contact us today.