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es-380 is a low-silver lead-free solder paste, an air re-flow, no-clean solder paste. It offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. High activity, cost-effective adoption of lead-free spherical powders and additives. Applied to generic lead-free environmentally friendly electronic assembly.
Key performance needs
� high oxidation barrier to eliminate grapping and hip defects
� high probe testability of minimizes false failures in ict
� highly probe testable flux residue, en14582 test method
� excellent print transfer efficiency on 0.4mm pitch csps
� oxidation resistance is strong,
� bright surface of solder, high activity
� very few residues and features such as transparent
� comparable with sac305 solder paste