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Contact SupplierHermetic lids to meet your microelectronic packaging requirements whether for the semiconductor, MEMS, medical or optical market. Our product line encompasses a full range of lids that can be customized to your specific application. View our lid application comparison chart. Available lids include:
Combo-Lidsâ„¢ - for high reliability applications
Micro-Lidsâ„¢ - for packages smaller than .300 in2
Seam Seal-Lidsâ„¢ - for sealing heat sensitive electronics
Solder Reflow-Lids™ - a cost alternative to the Combo-Lid®
Visi-Lidsâ„¢ - for optical packages
Non-Magnetic Lids - for specialty applications
Ceramic Combo Lidsâ„¢ - for specialty applications
Epo-Lidsâ„¢ - Epoxy-coated ceramic for commercial application