Model :- COF - 001 Chip On Flex

Designed to Reduce Packaging Interconnect in Various Applications, the chip On Flex Offered By Us Has High Bending Strength. Cof Circuit Modules with High Flexibility are Suitable for Bending with Full Flexibility in Most Areas Except Those Needing Component Mounting. Reducing Packaging Constraints and Costs for Device Assembly, the Chip On Flex Packaging is also Used in Display Products. Thinner Than Rigid Pcbs, the Chip On Flex is Suitable for Designing and Manufacturing of Lightweight, Faster and Compact Electronic Products.