Company Information
Member Since 8 Years
Nature of Business Supplier Year of Establishment 2010Ask for more detail from the seller
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Suzhou Sail technology co., LTD uses the advanced electroplating process and unique diamond dispersion technology, can make the hub blade of different specifications � hardness and concentration, the different craft and formula are used for different customers. We can effectively improve the quality and life of the dicing blade under the premise of meet the requirements of customers cutting. The blades are main used for PCB�BGA�ceramic substrate materials and Silicon wafer of cutting and scribing.
Choosing dicing blades with five important parameters
1.Diamond grit
2.The length of blade edge
3.The thickness of blade edge
4.The styles of adhesive
5.The styles of diamond concentration
Application scope:
Silicon wafer,GaAs,GaP,sapphire,ceramic
Packaging & Delivery
Packaging Details:Plastic box.
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