T   E   C  # 16/11 SPRA is a rapid curing non silicon solvent based semi permanent mold release agent in aerosols that provides multiple releases with no transfer to the molded part.

BENEFITS:

• High thermal stability up to 450°C.                                       
• Does not transfer on the part.
• Multiple releases between applications.
• High gloss finish.
• No buildup on the mold.
• Easy to apply.
• Reduces labor time and costs.
• Longer mold life.
• Mold cycle time reduced.
• Reduced post release treatment on part.
• Better and consistent product quality.
• Lower overall costs.

          T   E   C  # 16/11 SPRA is a rapid curing non silicon solvent based semi permanent mold release agent in aerosols that provides multiple releases with no transfer to the molded part.

BENEFITS:

• High thermal stability up to 450°C.                                       
• Does not transfer on the part.
• Multiple releases between applications.
• High gloss finish.
• No buildup on the mold.
• Easy to apply.
• Reduces labor time and costs.
• Longer mold life.
• Mold cycle time reduced.
• Reduced post release treatment on part.
• Better and consistent product quality.
• Lower overall costs.