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| Metric | Imperial | |
| Spindle Speed (Max.) | 13,000 RPM | |
| Power | 12V, 25W | |
| Runout (TIR) | 0.076mm | 0.003inch |
| Shank Diameter | 3.175mm | 1/8inch |
| Supplied Substrate Material | FR1 | |
| Bit Diameter (Max.) | 2mm | 0.078inch |
| Bit Length (Max.) | 38.1mm | 1.5inch |
Soldering
| Metric | Imperial | |
| Minimum Passive Size | 1005 | 0402 |
| Minimum Pin-to-Pin Pitch | 0.5mm | 20mil |
| Solder Paste Alloy | Sn42/Bi57.6/Ag0.4 | Sn42/Bi57.6/Ag0.4 |
| Solder Wire Alloy | SnBiAg1 | SnBiAg1 |
| Soldering Iron Temperature | 180-200°C | 355-390°F |
Solder Compatibility
| Sn42/Bi57.6/Ag0.4 Solder | Sn63/Pb37 Solder | |
| Standard Ink | ??? | ??? |
| Flexible Ink | ??? | ??? |
| Copper PCBs | ??? | ??? |
| HASL PCBs | ??? | ??? |
Footprint and Print Bed
| Metric | Imperial | |
| Dimensions (L × W × H) | 390mm × 257mm × 207mm | 15.4×10.1× 8.2inch |
| Weight | 7kg | 15.4lbs |
| Print Area | 128mm × 116mm | 5×4.5inch |
| Max. Heated Bed Temperature | 240°C | 464°F |
| Metric | Imperial | |
| Minimum Trace Width | 0.2mm | 8mil |
| Minimum Passive Size | 1005 | 0402 |
| Minimum Pin-to-Pin Pitch | 0.65mm | 26mil |
| Resistivity | 12mΩ/Sq @ 70um Height | 12mΩ/Sq @ 3mil Height |
| Supplied Substrate Material | FR4 | |
| Maximum Board Thickness | 3mm | 0.125inch |