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Contact SupplierPRO 1600 is a full forced air nitrogen convection reflow oven with only a 31" x 31" footprint of floor space. It has been designed for reflow soldering of even the most challenging applications including metal core, high thermal mass, and ceramic assemblies. PRO 1600 is very flexible in terms of profile development and optimization. Sealed heating chamber enables air ramp up rates of up to 4° Celsiussecond from ambient and programming of up to 10 profile zones. It offers a unique On-The-Fly settings adjustment capability that allows creating and optimizing profiles all in a single pass. Where other batch and conveyor ovens fail to meet the desired profile curve, PRO 1600 excels.
Precise software control delivers unsurpassed temperature uniformity. Maintaining a low delta T across all of the components on the assembly ensures that they are not overheated or thermally stressed. Even for prototypes, this often means avoiding to spend hours of testing and debugging failed boards. With the optional External Thermocouple Control (ETC), profiles may be processed based on temperature readings of the assembly, not the air temperature around it. An optional Video Recording and Observation Module allows taking high magnification images and recording video during a soldering cycle. Increased productivity, superior performance and ease of operation make the PRO 1600 a versatile system ideal for small to medium run production, prototyping, NPI, testing or curing.