Polyamic Acid of PMDA & ODA. High Thermal Stability upto 350 C. Used for fabrication of Polyimide Films, Wire Enamels, Anti corrosion Coatings, Spin Coating on Semiconductor Wafers, etc.

ABRON-S 10 is polyamic acid of pyromellitic dianhydride and diaminodiphenyl ether. It is a precursor used in the manufacture of polyimide insulation films. ABRON-S 10 can also be used for enameling rectangular & circular copper and aluminum wires. ABRON-S 10 is the starting material to manufacture porous polyimides and non-meltable polyimide powder (Equivalent to VESPEL® of DU-PONT).

The product made from ABRON-S 10 can withstand service temperature in the range of –180 to +350 °C.

APPLICATIONS :

• Circular & rectangular copper & aluminum wire enameling.
• Flexible PCBs.
• Polyimide Films.
• Chemical & corrosion resistant coatings.
• Porous polyimide components.

Polyamic Acid of PMDA & ODA. High Thermal Stability upto 350 C. Used for fabrication of Polyimide Films, Wire Enamels, Anti corrosion Coatings, Spin Coating on Semiconductor Wafers, etc.

ABRON-S 10 is polyamic acid of pyromellitic dianhydride and diaminodiphenyl ether. It is a precursor used in the manufacture of polyimide insulation films. ABRON-S 10 can also be used for enameling rectangular & circular copper and aluminum wires. ABRON-S 10 is the starting material to manufacture porous polyimides and non-meltable polyimide powder (Equivalent to VESPEL® of DU-PONT).

The product made from ABRON-S 10 can withstand service temperature in the range of –180 to +350 °C.

APPLICATIONS :

• Circular & rectangular copper & aluminum wire enameling.
• Flexible PCBs.
• Polyimide Films.
• Chemical & corrosion resistant coatings.
• Porous polyimide components.