Company Information
Member Since 8 Years
Nature of Business Supplier Year of Establishment 2010Ask for more detail from the seller
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Resin Bond Blade has rich elasticity and good self-sharpening, it is widely used in singulation field of semiconductor packaging materials and optical materials. A series of bonds in our company can meet different cutting requirements. What's more, we can provide customers service for different specifications and types according their needs.
Product characteristics:
1. new bond will be developed according to processing materials ;
2. customer can customize blades of different specifications and work performance
3. New hot pressing molding technology ensures product quality stability Processing objects QFN,DFN,optical glass, ceramic materials ect.
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