Rigid Copper Clad Laminate

we are offering rigid copper clad laminate.
specification:
ccl thickness:0.6mm,0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.5mm,3.0mm,4.0mm
thermal conductivity:1.0wm.k,1.5wm.k,2.0wm.k,3.0wm.k
dielectric thickness:80um-150um
copper foil:1oz,2oz,3oz
supply size:500×600mm400×1200mm500×1200mm600×1200mm,we can supply other size upon request.
item no. : al-h-06
feature:
meet the rohs requirements
excellent thermal conductivity
solder excellent performance
outstanding reliability
good machinability
excellent dimensional stability
electromagnetic wave shielding
application:
copper clad laminate is the electronic industrial base material, mainly used for the manufacture of printed circuit board (pcb), widely applied in television, radio, computer, mobile communications and other electronic products.