Silicon Interface Pad - 5519S

We are supplier of 3M Thermally Conductive Silicone Interface Pad 5519 in india.
3M Thermally Conductive Silicone Interface Pad 5519 is a highly conformable, slightly tacky silicone elastomer pad. Designed to provide heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices.
*Features of 3MThermally Conductive Silicone Interface Pad 5519 :-
Very high thermal conductivity (4.9 W/m-K)
Hardness :Shore 00 = 70
Good softness and conformability even to non-flat surfaces
Slight tack allows pre-assembly. Good wettability for better thermal conductivity
Good dielectric properties
UL 94 V-0
High temperature resistance
Tacky both sides
Thickness : 0.5 mm,1.0 mm, 1.5 mm, 2.0 mm, custom thickness
Larger sheet size is available
*Applications of 3M Thermally Conductive Silicone Interface Pad 5519 :-
Battery Thermal Management
Thermal Gap Pad
LED Lighting Thermal Management
Thermal Interface-Damping-Cushioning
Integrated chip (IC) packaging heat conduction
Heat sink interface
Chip on film (COF) heat conduction
LED board thermal interface material (TIM)
HDTV integrated chip (IC)
General gap filling in electronic dev
*Specifications:-
Application Category - Thermal Interface Materials
Base Material - Filled Silicone Polymer
Carrier Type - No Carrier
Color - Gray
Dielectric Strength - 3.1 kV/mm
Easy Release Top Liner Type -PET Film
Flammability Rating UL 94 V-0
HardnessShore 00 = 70
Liner Type Double
Product Series - 5519
Thermal Conductivity -4.1 W/m-K
Thermal Impedance - 0.29 Degree C-in (20.0 mil), 0.48 Degree C-i (40.0 mil), 0.65 Degree C-i
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