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    Solder Bath

    • Sold Bath Size4 x 4 x 4 (LBH in inches)
    • Temperatureup to 300oC
    • Sample Dipping Speed25 mm / sec
    • No of Dips0-9 programmable
    • Supply TypeManufacturer, Exporter, Supplier, Retailer
    • Preferred Buyer Location All over the world
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    Company Information

    • calendar Member Since 16 Years
    • building Nature of Business Retailer
    • Year of Establishment 1985

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    • Sold Bath Size4 x 4 x 4 (LBH in inches)
    • Temperatureup to 300oC
    • Sample Dipping Speed25 mm / sec
    • No of Dips0-9 programmable
    • Sample dippingautomatic using pneumatic arm.
    • Pickle Bath4 x 4 x 4 (LBH in inches)
    • Sample TransferAutomatic using motorized arm to travel between baths.
    • Dip Time0-99 sec programmable.

    model number: ssi 560 sbt

    standard number: iec 60245-2:1994

     

    the test is intended to verify the effectiveness of the separator between the non tinned conductor and insulation.

     

    instrument principle

    the test is intended to verify the effectiveness of the separator between the non tinned conductor and the insulation.

    the instrument consist of one pickling bath and one solder bath. The solder bath is designed to maintain a temperature of up to 300oc, as to keep the solder in a molten state.

    the ample is first dipped in the pickling bath and then dipped in the solder bath for predetermined cycles. The no of dips and the speed of dip can be controlled.

    standard

    the instrument conforms to iec 60245-2 : 1994

    instrument

     one pickling bath

     one solder bath

     an automated robotic arm to dip the sample in pickling and solder bath

     the arm is also designed to transfer the sample form pickling to solder bath

     plc to control the instrument.

     hmi for display and interacting with the operator.

     


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