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    Special Grade Micron Diamond Powder

    • MOQ1000 Kilogram
    • Supply TypeManufacturer, Exporter, Supplier
    • Preferred Buyer Location All over the world

    Model No : SMT-SA (For PDC) Property : Good quality MBD series diamond with high strength as raw material, by special process and particle surface cleaning treatment; with regular crystal, good heat....
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    • calendar Member Since 11 Years
    • building Nature of Business Supplier
    • Year of Establishment 1980

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    Model No : SMT-SA (For PDC)

    • Property : Good quality MBD series diamond with high strength as raw material, by special process and particle surface cleaning treatment; with regular crystal, good heat stability and abrasive resistance, good for sintered growing of PDC and PCD.
    • Usage : For PDC,  PCD,  wire drawing die, coated abrasives, ceramics, metal bond abrasives.
    • Available Size : W0-0.5, W0-1, W0.5-1, W0.5-1.5, W0-2, W1-2, W0.5-3, W1-3, W1.5-3, W2-3, W2-4, W2-5, W3-6, W3-7, W4-8, W4-9, W5-10, W5-12, W6-12, W8-12, W8-16, W8-20, W10-20, W12-22, W12-25, W15-25, W20-30, W22-36, W20-40, W30-40, W30-50, W36-54, W40-50, W40-60


    Model No : SMT-SB (For Abrasive Brick)

    • Property : High quality diamond as raw material, by special processing, with irregular particle shape and multi-edge with high sharpening performance. Promoting wear resistance and extending working life.
    • Usage : Making abrasive brick of diamond resin binder.
    • Available Size : W0-0.5, W0-1, W0.5-1, W0.5-1.5, W0-2, W1-2, W0.5-3, W1-3, W1.5-3, W2-3, W2-4, W2-5, W3-6, W3-7, W4-8, W4-9, W5-10, W5-12, W6-12, W8-12, W8-16, W8-20, W10-20, W12-22, W12-25, W15-25, W20-30, W22-36, W20-40, W30-40, W30-50, W36-54, W40-50, W40-60


    Model No: SMT-SC (For Wire)

    • Property : MBD series diamond with good quality and high strength as raw material, by special reshaping, selecting processing, no big size. With better crystal,  concentrated size distribution, promoting abrasive ability by increasing the number of efficient grinding particle.
    • Usage : For cutting equipment production such as wire saw; for coarse and fine grinding, polishing in new hard and brittle material such as monocrystal silicon,  polycrystal silicon, diamond, quartz, LCD, magnetic material, semiconductor.
    • Available Size : W0-0.5, W0-1, W0.5-1, W0.5-1.5, W0-2, W1-2, W0.5-3, W1-3, W1.5-3, W2-3, W2-4, W2-5, W3-6, W3-7, W4-8, W4-9, W5-10, W5-12, W6-12, W8-12, W8-16, W8-20, W10-20, W12-22, W12-25, W15-25, W20-30, W22-36, W20-40, W30-40, W30-50, W36-54, W40-50, W40-60


    Additional Information

    • Payment Terms L/C, D/PT/T
    • Packaging DetailsIn bag or bottle
    • Delivery Time7 days for ready material
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