SPI HS60 Solder Paste Inspection System

SPI HS60 Series is PARMI’s best selling model, and is installed and used in many global SMT production sites with proven performance and stability.
The PARMI laser measurement head uses a method called optical triangulation to measure the height, area and volume of each pad. Our internally designed RSCV laser sensor head uses two laser beams coming from opposite angles (dual laser) to completely eliminate the effect of shadows on the measurement data (zero shadow effect). This combined with our PARMI developed MPM (Multiple Profile Correction) technology can create an exact and accurate 3D image of every pad. Furthermore, our laser head also moves up and down on the Z-axis to maintain a constant distance from the PCB panel. This tracking function enables the PARMI SPI to accurately read PCB warp in real time, and produce a heat map warp image of the complete board while at the same time reproducing an accurate 3D recreation of every single pad on the PCB. It will also automatically highlight pad offset, bridge, insufficient and excess on the image