Sps Copper Electroplating Intermediate

We are offering sps copper electroplating intermediate.
chemical nature
chemical name bis-(sodium sulfopropyl)-disulfide
molecular formula c6h12na2 o6s4
molecular weight 354.4
cas no. 27206-35-5
properties
physical form white to yellowish powder
concentration (%) ≥90.0（hplc）
ph 3.0 ~ 7.0(38 % water solution)
solubility(20℃) 38 % water solution is transparent and clear
application
sps is used as a brightener and grain refiner in copper electroplating baths at a concentration of 10-50mgl.
packing
25 kgiron drum, stored in cool and dry place.