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Contact SupplierPrecision Automatic Lapping Polishing Machine TCH - EQ-Unipol-1502
TCH-EQ-UNIPOL-1502 polishing machine equips with 14 -15" diameter super flat lapping plate and can be used as a high precision lapping machine for polishing crystal components, semiconductor wafers, and ceramic substrates up to 4" diameter with three workstations. It also can be adopted a standard grinding and polishing machine for preparing metallographic samples.
Specification:
Voltage
AC 110V and 208-240V (5060Hz) switchable for worldwide operation.
Power 400W
Two Super Flat Lapping Plate Flatness
Precision Rotating Shaft Running off
Features
One cast iron plate for lapping and one cast aluminum plate for polishing
Heavy duty cast aluminum case with bright painting
Three rocking workstations with wafer holders and condition rings.
They can be controlled independently for polishing 3 pcs of 4" wafers or 9 pcs of 2" wafers in one running
Adjustable Timer for Auto-stop 0~99 hours
Variable Speed 0 to 80 RPM with digital display
Diamension
720L *580W *380H mm
Optional Accessories
Consumables for polishinglappinggrinding (sand paper, pad, plate, slurry, molding, coolant, etc)
Accessory equipment (slurry feeder, carrierchuck, thickness meter, weights, etc)
4" Polishing Fixture With Pressure Indicator for Precision Automatic Thinning and Polishing- EQ-PF-4-1P is available at extra cost
Compliance
CE Certified